The chip will arrive in the first quarter of 2027 instead of the third, with performance announced to be doubled — but the associated supercomputer has melted in the process.
Huawei has announced that its Ascend 960DT accelerator will be released in the first quarter of 2027, two quarters earlier than the initially communicated schedule. The group claims a doubling of performance compared to the previous generation.
The announcement is accompanied by the deployment of the Peerium architecture, designed to link hundreds of thousands of chips within a single computing set; the Atlas 950 SuperCluster can thus federate up to 256,000 accelerator cards. The timing is not neutral: the communication comes a week before a meeting between Donald Trump and Xi Jinping in Washington, while American restrictions continue to deprive Huawei of the most advanced engraving processes.
Analyst Rui Ma notes an inconsistency in the message: while the chip arrives much earlier, the SuperPoD presented with it is much more modest than expected — 4,096 chips compared to the 15,488 previously announced. In other words, silicon is accelerating, but very large-scale assembly remains the sticking point.
Read the full article on the original source
Go to the source →